Effect of bath temperature for Cu electroless deposition onto acrylon nitril butadiene (ABS) insulating substrate
Bath temperature (Tbath) influences on electroless plating rate and on morphology,
structure, corrosion resistively of the deposited Cu layers. In the range Tbath = 25 - 70oC the
increasing Tbath results an increase of the deposition rate, while the deposition rate
decreases as T bath increases from 70 to 90oC due to the bulk reduction of Cu2+.
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Journal of Chemistry, Vol. 44 (5), P. 642 - 647, 2006
EFFECT OF BATH TEMPERATURE FOR Cu ELECTROLESS
DEPOSITION ONTO ACRYLON NITRIL BUTADIENE (ABS)
INSULATING SUBSTRATE
Received 8 August 2005
MAI THANH TUNG, LAI HUY NAM
Dept. of Electrochemistry and Corrosion Protection, Hanoi University of Technology
SUMMARY
Influences of bath temperature (Tbath) on Cu electroless deposition rate and on morphology,
structure, corrosion resistivity of deposited Cu layers were investigated. Results showed that the
increasing Tbath from 25 to 70oC resulted an increase of the deposition rate, while the deposition
rate decreased as Tbath increased from 70 to 90oC due to the bulk reduction of Cu2+. SEM results
indicated that the crystals of deposited layers became finer as Tbath increased. XRD analyses
showed that mean grain size Lmean decreased and intensity ratio I(111)/I(200) increased
remarkably with increasing Tbath from 25 to 70oC and changes of both Lmean and I(111)/I(200) are
less pronounce in the range of Tbath = 70 - 90o. The corrosion resistivity increased remarkably
with increasing Tbath from 25 to 70oC and became nearly invariable the range of Tbath = 70 - 90o.
These results were explained by the relation between structure and corrosion properties of the
electrolessly deposited Cu layers.
I - INTRODUCTION
Electroless deposition technique has been
intensively studied due to its important
applications in electronics, surface technology
and modern micro- and nanotechnology [1 - 4].
The main advantage of the electroless
deposition technique is the possibility to form
metal layers on insulating and semiconducting
substrates. Among the metals used for
electroless deposition, Cu is one of the most
important materials due to its high conductivity
and good mechanical properties. Therefore, the
Cu electroless deposition became the key
process in printed circuit boards (PCBs)
production and metallization process in plastic
industry [1 - 7]. The Cu electroless deposition
process is based on the so-called autocatalytic
effect of Cu2+ reduction when electrocatalytic
metals such as Pt, Pd (activators) are present on
the surfaces [6 - 8]. Typically, the Cu electroless
deposition bath contains metal sources (Cu2+)
and a reducing agent (HCHO) and the
deposition occurs following two reactions [6, 7]:
Cathode process: Cu2+ + 2e Cu (1)
Anode process:
2HCHO + 4OH- 2HCOO- + 2H2O + 2e (2)
(The process (2) is initiated on surfaces of
activators Pd, Pt)
Since kinetics of the deposition process are
controlled by both processes (1) and (2), the
deposition rate and structure, morphology,
mechanical properties of deposited films are
influenced by activators, bath composition and
temperature. It has been shown in several
studies that bath temperature plays a very
important role during the plating process and
decides structure and properties of the obtained
layers [2, 6 - 8].
643
In this work, we will show results of study
on the influences of bath temperature on
deposition rate and structure, morphology,
mechanical properties of Cu electrolessly
deposited films onto Acrylon Nitril Butadiene
(ABS) surface.
II - EXPERIMENTAL
The electroless deposition was performed on
ABS plastic. Prior to the plating, the ABS
samples were polished, degreased and rinsed
carefully. In order to prepare rough and
hydrophilic ABS surfaces, samples were
pretreated in etching solution (CrO3 150 g/l,
H2SO4 400 g/l, t = 70
oC). The electroless
deposition process consisted of 3 steps:
sensization, activation and electroless
deposition. Solutions and conditions for the
processes are given in table 1.
Table 1: Solutions and conditions of the Cu electroless deposition steps
Step Solution Temperature pH Duration
Sensization (BK-PLAC-sens) 1g/l SnCl2.2H2O +surfactance 25
oC - 2 min
Activation (BK-PLAC-act) 0,1 g/l PdCl2.2H2O +complex agent 25
oC - 2 min
Plating solution (BK-PLAC-
plat)
20 g/l CuSO4.6H2O
6 ml/l HCHO (37%)
35 g/l EDTA
26 g/l NaOH
25 - 90oC 11 15 min
Average deposition rate was determined by
mass method, which followed 2 steps: (i)
dissolution of deposited Cu film and (ii)
determination of the mass (m) of dissolved Cu
by chemical analysis. The average deposition
rate v was calculated by the equation:
410.
.. tAD
mv
Cu
= (3)
where v is plating rate (µm/h), DCu is density of
Cu (g/cm3), A is total area of sample (cm2), t is
deposition time (h).
Surface morphologies of the obtained
deposited films were analysed using Scanning
Electron Microscopy (SEM) (JMS 5410–Jeol
equipment). XRD analysis was carried out using
Bucker D8 Advance diffractometer. The mean
grain size Lmean of the deposited Cu was
estimated using the (111) peak broadening
according to Sherrer’s equation [5]:
2cos
94.0
×
×
=
eff
Cu
mean W
L (4)
where Cu is wavelength of Cu (= 0.1542 nm),
Weff is effective full width at half maximum
(determined from the Gaussian distribution
function of (111) peak), 2 is diffraction angle.
Polarization measurements were performed in a
conventional three-electrodes electrochemical
cell with a saturated calomel electrode (SCE)
and a Pt counter electrode. Total surface of
working electrode was 2.4 cm2. Before
measurements, samples were immersed for 5
minutes in the measuring solution (HCl 0.1N).
III - RESULTS AND DISCUSSION
Fig.1 displays the influence of bath
temperature (Tbath) on the Cu electroless
deposition rate. Results show that in the range
Tbath = 20 - 70
oC the deposition rate increases
with increasing temperature. This behaviour is
expected since kinetics of both reactions (1) and
(2) are temperature dependent and the rates of
reactions (1) and (2) increase exponentially with
the factor (-1/Tbath) [2, 3]. However, in the range
Tbath = 70 - 90
oC the plating rate decreases with
increasing Tbath (Fig. 1). The reason for this is
that the reactions (1) and (2) occur not only on
the surfaces to form Cu layer, but also in bulk to
form Cu particles in the solution since the
processes in bulk solution become
thermodynamic and dynamic favourable at Tbath
644
> 70oC. As a result, the bulk reactions increase
and become dominated, leading to the decrease
of the deposition rate. At Tbath > 100
oC, intact Cu
deposited layers even cannot be formed on the
ABS surface due to the severe reactions in the
bulk solution to form dispersed Cu particles [3].
Bath temperature Tbath,
oC
Figure 1: Influence of bath temperature Tbath on Cu electroless deposition rate v
The formation of Cu particles in the solution
can also be confirmed by the SEM images (Fig.
2). While the deposited Cu surfaces at Tbath =
25oC, 40 oC, 70oC are clean (Fig. 2a-2c), it can
be observed that Cu crystals formed by the bulk
reactions with typical size of 2 – 4 µm are
adsorbed on the Cu deposited surface at 90oC
(Fig. 2d). It is also very interesting to note that
the crystal structures of deposited layers are
finer as Tbath increases. This result can be
explained by the fact that the number of new Cu
nuclei increases due to the high nucleation rate
at high Tbath, while at low Tbath nucleation energy
is low and the growth of the Cu crystals
becomes more favorable than the formation of
new nuclei [2, 3].
Structures of the electrolessly deposited
layers at different Tbath were analyzed using
XRD method. Results presented in Fig. 3 show
that (111) and (200) textures appear for all
deposited films and (111) is the dominated
texture. However, the intensity of (111)
orientation increases with increasing Tbath (Fig.
3). Table 2 shows the intensity ratios
I(111)/I(200) of calculated from peak intensities
of XRD patterns. The obtained results indicate
that I(111)/I(200) increases with Tbath = 25 -
70oC and no remarkable changes are observed
with Tbath = 70 - 90
oC. Table 2 also shows the
changes of grain size L calculated by Scherrer’s
equation (eq. 4). It is interesting to mention that
the grain size also increases strongly with Tbath =
25 oC - 70 oC and changes slightly with Tbath =
70 - 90oC.
Fig. 4 shows the polarization curves in HCl
0.1 M of the obtained Cu layers at different Tbath.
It can be observed that Cu layers deposited at
higher Tbath have better corrosion resistivity e.g
lower corrosion current density icorr and less
negative corrosion potential Ecorr (Fig. 4 and
table 2). It is very interesting to note that again
the changes of icorr and Ecorr are remarkable with
Tbath = 25 - 70
oC and are less pronounce as Tbath
increases from 70oC to 90oC. This corrosion
behaviour can be explained by the correlation
with grain size and crystal structure. It has been
reported that the deposited layers with lower
grain size have lower defect density, meaning
that the Cu deposited layers with smaller grain
size are more corrosion resistant [2 - 4, 7, 8]. On
the other hand, the (111) plane has lowest
surface energy among all Cu planes and thereby
the (111) texture is less active to corrosive
media. Thus, the decrease of grain size and the
increase of content of (111) texture result the
Pl
at
in
g
ra
te
v,
µm
/h
645
decrease of icorr as Tbath increases (table 2). The
increase of Ecorr as Tbath increases may be
explained by the passivation of the deposited Cu
layer.
(A) 25 C o (A) 40 C o
(A) 70 C o (A) 90 C o
2 mµ 2 mµ
2 mµ 2 mµ
Cu crystals
formed in bulk
solution
Figure 2: SEM images of Cu electrolessly deposited layers with Tbath of
(a) 25oC (b) 40oC (c) 70oC (d) 90oC
2, o
Figure 3: XRD patterns of Cu electrolessly deposited layers with Tbath of
(a) 25oC (b) 40oC (c) 70oC (d) 90oC
In
te
ns
ity
,a
.u
646
E, SCE/V (1997)
Figure 4: Polarization curves in HCl 0.1M of Cu electrolessly deposited layers with Tbath of
(a) 25oC (b) 40oC (c) 70oC (d) 90oC
Table 2: Intensity ratio I(111)/I(200), mean grain size Lmean, corrosion potential Ecorr and corrosion
current density icorr of electrolessly deposited layers with different Tbath
Parameters T = 25oC T = 40oC T = 70oC T = 80oC
I(111)/I(200) 2.52 2.67 2.89 2.91
Mean grain size Lmean (nm) 77 62 47 45
Corrosion potential Ecorr (V) (SCE) -0.308 -0.292 -0.277 -0.273
Corrosion current density icorr (A/cm
2) 4.47.10-7 3.71.10-7 3.02.10-7 2.51.10-7
IV - CONCLUSIONS
Bath temperature (Tbath) influences on
electroless plating rate and on morphology,
structure, corrosion resistively of the deposited
Cu layers. In the range Tbath = 25 - 70
oC the
increasing Tbath results an increase of the
deposition rate, while the deposition rate
decreases as Tbath increases from 70 to 90
oC due
to the bulk reduction of Cu2+. SEM results
indicate that the crystals of deposited layers
became finer as Tbath increases. XRD results
show that intensity ratio I(111)/I(200) increases
and mean grain size Lmean decreases remarkably
as Tbath increases from 25 to 70
oC and changes
of both Lmean and I(111)/I(200) are less
pronounce in the range of Tbath = 70 - 90
oC. The
corrosion resistively increases also remarkably
with increasing Tbath from 25 to 70
oC and less
pronounce in the range of Tbath = 70 - 90
oC.
These results were explained by the relation
between structures and corrosion properties of
the deposited layers.
Acknowledgements: We thank the Research
Fund of Ministry of Education and Training
(Project Nr. B-2004-28-152) and VLIR-HUT
Research Fund (Project Nr. VLIR-
HUT/IUC/PJ10) for the financial support of this
work.
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